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ProductsSemiconductor MaterialsHigh-Purity Sputtering Target
High-Purity Sputtering Target

High-Purity Sputtering Target

High-purity sputtering target (99.999%+ purity), suitable for advanced node thin-film deposition.

Description
Specifications
Applications

Manufactured using vacuum melting and isostatic pressing processes, featuring a uniform grain structure that effectively reduces film defects and extends target lifespan.

Purity: 99.999% (5N) Dimensions: Customizable based on process requirements Type: Planar target / Rotary target

Semiconductor Thin Film Deposition

Optoelectronic Coating

Advanced Packaging Metalization (or Metallization Layer)

Description

Manufactured using vacuum melting and isostatic pressing processes, featuring a uniform grain structure that effectively reduces film defects and extends target lifespan.

Specifications
Applications

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