COHO Advanced Materials Tech. Co., Ltd. has been dedicated to advanced ceramics, specialty materials, and precision manufacturing technologies for more than two decades. With extensive expertise in material development, forming, sintering, and precision machining, COHO serves a wide range of high-value industries, including semiconductors, power electronics, advanced thermal management, optical communications, and high-end industrial applications.

COHO Advanced Materials —
Advanced Materials For Next-Generation
Technologies.
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Materials Technology × Process Integration × Precision Machining × Application Development
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Core Materials & Manufacturing Capabilities
Since 2016, COHO has expanded its material development capabilities into energy technologies, advanced thermal management, and high-thermal-conductivity ceramics. The company invested in ceramic fuel cell stack technologies and successfully established mass-production capabilities for high-thermal-conductivity aluminum nitride (AlN) substrates. Driven by the rapid growth of semiconductors, high-power electronics, and AI computing, COHO continues to focus on the development of materials featuring high thermal conductivity, low thermal expansion, high electrical insulation, and superior plasma resistance, further strengthening its presence in semiconductor and advanced thermal management applications. COHO's core material portfolio includes aluminum nitride (AlN), aluminum oxide (Al₂O₃), zirconium oxide (ZrO₂), silicon carbide (SiC), aluminum silicon carbide (AlSiC), yttrium oxide (Y₂O₃), YAG, ALON, and other advanced functional materials. With vertically integrated capabilities spanning material formulation, powder processing, precision forming, sintering, CNC precision machining, surface treatment, metrology, analytical testing, and quality validation, COHO provides one-stop manufacturing solutions tailored to customer requirements. Our engineering teams work closely with customers on material selection, structural design, process development, and customized manufacturing, accelerating the transition from concept and prototyping to stable mass production.
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Integrating Materials Technology to Enable Advanced Applications
As Co-Packaged Optics (CPO), Silicon Photonics, and high-speed optical communications continue to advance, COHO is extending its established precision ceramic forming and micro-machining technologies into MT Ferrules, MT Alignment components, and ceramic components for optoelectronic packaging. By combining high-precision dimensional control, high-thermal-conductivity materials, and low-thermal-expansion characteristics, COHO is progressively building an Advanced Ceramic Solutions platform designed for AI-driven high-speed data transmission and next-generation optoelectronic packaging. COHO's core competitiveness goes beyond manufacturing individual products. It lies in our comprehensive understanding of the relationship between materials, processes, structures, and applications. From material formulation, sintering mechanisms, and microstructure control to precision machining, reliability validation, and mass-production management, COHO continues to develop proprietary technologies and manufacturing know-how. Through cross-material and cross-process integration, we help customers address complex material challenges in demanding environments involving high temperatures, high power, high vacuum, plasma exposure, and ultra-high-precision applications.
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Future Development & Technology Roadmap
Looking ahead, COHO will focus on four major growth areas: critical ceramic components for semiconductor equipment, advanced thermal management materials, power electronics, and CPO/optoelectronic packaging. We will continue to advance technologies in high thermal conductivity, plasma resistance, electrical insulation, low thermal expansion, and high reliability, while accelerating manufacturing automation, digital transformation, and quality management enhancement. Evolving from a precision ceramics manufacturer into an advanced materials solutions provider, COHO is committed to leveraging its long-established expertise in materials science and precision manufacturing to collaborate with customers worldwide. Together, we aim to develop the critical materials and precision components that enable the next generation of semiconductors, AI computing, high-speed communications, and high-power electronics.
Corporate Vision
Three Core Businesses
COHO — Your Trusted Choice for Advanced Materials.
Group History
- 2026Developed an environmentally conscious micro deep-hole cleaning process for precision ceramic components.Collaborated with a Japanese industry partner on the development of AlN heaters for advanced applications.Collaborated with the Industrial Technology Research Institute (ITRI) to develop process technologies for the recycling and reuse of critical materials.
- 2024Established a dedicated Semiconductor Ceramics CIP Team to advance ceramic sintering and machining technologies with a focus on energy-efficient manufacturing.Established the Sustainability Action Office and completed the company’s greenhouse gas emissions inventory and report.
- 2020Launched a high-thermal-conductivity Aluminum Nitride (AlN) substrate with thermal conductivity of 230 W/m·K.
- 2017Collaborated with an industry partner to develop fuel cell stack technology.
- 2015Advanced plasma surface modification technology for ceramic implants and was selected for Taiwan’s A+ Industrial Innovation R&D Program supported by the Ministry of Economic Affairs.
- 2014Obtained TFDA, FDA, and CE regulatory approvals for our ceramic dental implant system, marking a significant milestone in the Asian ceramic implant industry.
- 2010Achieved ISO 9001 and ISO 13485 certifications.Received the Small Business Innovation Research (SBIR) Award in recognition of technological innovation and R&D achievements.
- 2005Began manufacturing ceramic surgical knives for an international medical device company.
- 2001COHO was established, with ceramic and metal injection molding (CIM/MIM) capabilities developed for the production of ceramic and metal fiber-optic connector components.
