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ProductsSemiconductor MaterialsAdvanced packaging substrate materials
Advanced packaging substrate materials

Advanced packaging substrate materials

Substrate materials featuring low dielectric loss and high dimensional stability.

Description
Specifications
Applications

Engineered for high-frequency and high-speed signal transmission, featuring low moisture absorption and excellent thermal stability, suitable for advanced packaging and high-end IC substrates.

Dielectric Constant (Dk): ≤ 3.0 Coefficient of Thermal Expansion (CTE): Low CTE Heat Resistance: Lead-free reflow compatible

Advanced Packaging Substrates

High-Frequency Communication Modules

High-End HDI PCBs (or High-Tier HDI Boards)

Description

Engineered for high-frequency and high-speed signal transmission, featuring low moisture absorption and excellent thermal stability, suitable for advanced packaging and high-end IC substrates.

Specifications
Applications

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